Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits. Al-Khwarizmi Engineering Journal, [S. l.], v. 10, n. 2, p. 32–48, 2017. Disponível em: https://alkej.uobaghdad.edu.iq/index.php/alkej/article/view/197. Acesso em: 3 apr. 2025.